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Tenstorrent achieves best-in-class PPA and First-Pass Silicon Success for Datacenter AI Processor SoC with INVECAS advanced ASIC engineering capabilities

Santa Clara (California)[US]/Hyderabad (Telangana)[India], October 22 (ANI/PRNewswire): INVECAS Inc, a leading provider of ASIC design solutions, and Tenstorrent Inc, a leading AI/ML processor company, announced today that Tenstorrent has achieved first-pass silicon success for its recently announced Grayskull AI processor system-on-chip (SOC) utilizing INVECAS Advanced Chip Builder Tool (ACT™) physical implementation flow to achieve predictable design convergence, best-in-class PPA and accelerate time-to-tape-out for complex design.Santa Clara (California)[US]/Hyderabad (Telangana)[India], October 22 (ANI/PRNewswire): INVECAS Inc, a leading provider of ASIC design solutions, and Tenstorrent Inc, a leading AI/ML processor company, announced today that Tenstorrent has achieved first-pass silicon success for its recently announced Grayskull AI processor system-on-chip (SOC) utilizing INVECAS Advanced Chip Builder Tool (ACT™) physical implementation flow to achieve predictable design convergence, best-in-class PPA and accelerate time-to-tape-out for complex design.Read More

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